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TSMC 7+ Nanometer Chips Are in High Volume Production With 5, 6 nm in 2020
The N7+ process with EUV technology is built on TSMC's successful 7nm node and paves the way for 6nm and more advanced technologies.
The leading edge is currently at 7+ with about three layers done using EUV. In 2020, TSMC will ramp 5nm in the second half with significantly increased EUV usage of about 15 layers, followed by 6nm ramping at the end of 2020 with about four layers done in EUV, according to Jim Fontanelli, a senior analyst with Arete Research.
N7+ is also providing improved overall performance. When compared to the N7 process, N7+ provides 15% to 20% more density and improved power consumption, making it an increasingly popular choice for the industry's next-wave products. TSMC has been quickly deploying capacity to meet N7+ demand that is being driven by multiple customers.